Assembly Process Engineer
to cover all aspects of product assembly with a focus on high volume automated die attach and wire bonding assembly equipment. The role will involve developing and maintaining all equipment and processes within the manufacturing area, as well as providing high level technical support for yield improvement. Liaising with equipment suppliers will be an important part of the role.
Required Skills:
Semiconductor assembly manufacturing process and equipment experience
Detailed knowledge of die attach and wire bonding processes
Process improvement knowledge
Strong communication skills
Relevant Engineering Degree (or equivalent)
Please contact
Rachel Anderson
for further details.
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