This is an opportunity for a Lead RF IC Design or MMIC Designer to join an expanding company working on developing high-tech communications and radar technologies.
In this role, you will have the opportunity to work on antenna technology to serve markets including broadband mobility, satellite communications, and the Internet of Things (IoT).
As the Lead RF IC Design Engineer, you will take a lead role responsible for leading the design of Ku/Ka band RF Transmitters & Receivers using deep sub-micron technologies for the next generation of satellite communications. You will be responsible for the delivery of ASIC Specifications, architecture design, circuit design & verification, review, IC qualification & production release.
You will lead and mentor a team of RF IC Design engineers and work closely across the organization from layout & test teams to systems, antenna, and hardware teams to ensure on-time delivery of leading ASICs. You will also assist in choosing the fabrication process & technology vendors, set up process flow, ensure design governance, and create product development plans and technology roadmaps.
Industry degree qualified, you will have a minimum of 10 years of experience in the design of RF ICs in deep sub-micron technologies (preferably 15GHz or higher operating frequencies) with chip lead experience in 2 or more successful tape-outs.
Responsibilities Include:
ASIC specifications, architecture design, top-level design & verification, block-level designs, and on-time tape-out of ASICs. Design of transmitter & receiver blocks in Ku/Ka band in deep sub-micron CMOS technologies. Hands-on block-level design of various RF blocks such as PA, LNA, VGA, Phase shifters, and Power Splitters/combiners. Delivering high-quality RF/Analog blocks with leading-edge performance using innovative architectures and circuit implementations. Coordinate and manage design activities with other colleagues. Collaborate with CAD, process technology, package design, Antenna & hardware teams. Document own work and lead design reviews. Experience is desired in 22nm FDSOI or other sub-45nm CMOS process nodes for RF/High-speed ICs and/or experience in mmW/RF IC design, LNA design, and RF PAs.
Excellent communication skills are required, as well as the ability to take responsibility for complex circuit and system designs within delivery timescales. You will have the ability to interact with engineering teams across multiple disciplines during ASIC project stream development.
Visa sponsorship is available for the successful applicant.
Contact Leon to apply and find out more.
Please note that if you are NOT a passport holder of the country for the vacancy, you might need a work permit.
Check our Blog for more information.
Bank or payment details should not be provided when applying for a job. Eurojobs.com is not responsible for any external website content. All applications should be made via the 'Apply now' button.
Created on 22/01/2025 by TN United Kingdom
#J-18808-Ljbffr
In this role, you will have the opportunity to work on antenna technology to serve markets including broadband mobility, satellite communications, and the Internet of Things (IoT).
As the Lead RF IC Design Engineer, you will take a lead role responsible for leading the design of Ku/Ka band RF Transmitters & Receivers using deep sub-micron technologies for the next generation of satellite communications. You will be responsible for the delivery of ASIC Specifications, architecture design, circuit design & verification, review, IC qualification & production release.
You will lead and mentor a team of RF IC Design engineers and work closely across the organization from layout & test teams to systems, antenna, and hardware teams to ensure on-time delivery of leading ASICs. You will also assist in choosing the fabrication process & technology vendors, set up process flow, ensure design governance, and create product development plans and technology roadmaps.
Industry degree qualified, you will have a minimum of 10 years of experience in the design of RF ICs in deep sub-micron technologies (preferably 15GHz or higher operating frequencies) with chip lead experience in 2 or more successful tape-outs.
Responsibilities Include:
ASIC specifications, architecture design, top-level design & verification, block-level designs, and on-time tape-out of ASICs. Design of transmitter & receiver blocks in Ku/Ka band in deep sub-micron CMOS technologies. Hands-on block-level design of various RF blocks such as PA, LNA, VGA, Phase shifters, and Power Splitters/combiners. Delivering high-quality RF/Analog blocks with leading-edge performance using innovative architectures and circuit implementations. Coordinate and manage design activities with other colleagues. Collaborate with CAD, process technology, package design, Antenna & hardware teams. Document own work and lead design reviews. Experience is desired in 22nm FDSOI or other sub-45nm CMOS process nodes for RF/High-speed ICs and/or experience in mmW/RF IC design, LNA design, and RF PAs.
Excellent communication skills are required, as well as the ability to take responsibility for complex circuit and system designs within delivery timescales. You will have the ability to interact with engineering teams across multiple disciplines during ASIC project stream development.
Visa sponsorship is available for the successful applicant.
Contact Leon to apply and find out more.
Please note that if you are NOT a passport holder of the country for the vacancy, you might need a work permit.
Check our Blog for more information.
Bank or payment details should not be provided when applying for a job. Eurojobs.com is not responsible for any external website content. All applications should be made via the 'Apply now' button.
Created on 22/01/2025 by TN United Kingdom
#J-18808-Ljbffr
