As a Scientist/Senior Scientist within Q.InC, you will join our team to develop cutting-edge quantum packaging technology platforms. These platforms will enable the low-noise, high density integration of qubits and control chips on superconducting interposers. You will work in a dynamic, interdisciplinary environment, collaborating with cross-functional teams to:
Design and develop 3D superconducting interconnects. Explore wafer-to-wafer superconducting hybrid bonding techniques. Establish design rules and Process Design Kits (PDKs) for quantum packaging technologies. Prepare competitive research grant proposals to advance the state of the art. Partner with industry stakeholders to build foundational technologies for next-generation quantum packaging platforms.
Job Responsibilities: Develop and optimize process flows based on quantum component requirements, closely monitoring lot movements and ensuring alignment with project milestones. Collaborate with equipment and materials suppliers, as well as end-users, to advance quantum packaging technologies. Define and implement design rules and PDKs for superconducting qubit components. Work with technical and business development teams to initiate industry consortia projects with supply chain partners. Collaborate with other programs, A*STAR institutes, and academic institutions to prepare research grant proposals.
Job Requirements: PhD in Quantum Computing, Electrical and Computer Engineering, Materials Science, or a related field with understanding of semiconductor material and manufacturing, chip integration or quantum technologies. 2 to 5 years of experience in semiconductor or quantum process development and integration, with a basic understanding of 3D quantum packaging. Hands-on experience with process development, integration, and monitoring in semiconductor packaging. Familiarity with 3D interconnect technologies, wafer bonding, and other advanced packaging techniques. Experience with quantum device fabrication and testing is a plus. Knowledge of superconducting materials and processes, such as hybrid bonding and superconducting interposers. Proven ability to develop and execute innovative R&D projects, especially in emerging technologies. Experience working with cross-functional teams, industry partners, and consortia. Excellent written and verbal communication skills for engaging with academic, industrial, and governmental stakeholders. Self-motivated, proactive, and capable of effectively collaborating with diverse teams to achieve project goals. The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified. Type of Employment :
Full-Time Minimum Experience :
2 Years Work Location :
Fusionopolis
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Design and develop 3D superconducting interconnects. Explore wafer-to-wafer superconducting hybrid bonding techniques. Establish design rules and Process Design Kits (PDKs) for quantum packaging technologies. Prepare competitive research grant proposals to advance the state of the art. Partner with industry stakeholders to build foundational technologies for next-generation quantum packaging platforms.
Job Responsibilities: Develop and optimize process flows based on quantum component requirements, closely monitoring lot movements and ensuring alignment with project milestones. Collaborate with equipment and materials suppliers, as well as end-users, to advance quantum packaging technologies. Define and implement design rules and PDKs for superconducting qubit components. Work with technical and business development teams to initiate industry consortia projects with supply chain partners. Collaborate with other programs, A*STAR institutes, and academic institutions to prepare research grant proposals.
Job Requirements: PhD in Quantum Computing, Electrical and Computer Engineering, Materials Science, or a related field with understanding of semiconductor material and manufacturing, chip integration or quantum technologies. 2 to 5 years of experience in semiconductor or quantum process development and integration, with a basic understanding of 3D quantum packaging. Hands-on experience with process development, integration, and monitoring in semiconductor packaging. Familiarity with 3D interconnect technologies, wafer bonding, and other advanced packaging techniques. Experience with quantum device fabrication and testing is a plus. Knowledge of superconducting materials and processes, such as hybrid bonding and superconducting interposers. Proven ability to develop and execute innovative R&D projects, especially in emerging technologies. Experience working with cross-functional teams, industry partners, and consortia. Excellent written and verbal communication skills for engaging with academic, industrial, and governmental stakeholders. Self-motivated, proactive, and capable of effectively collaborating with diverse teams to achieve project goals. The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified. Type of Employment :
Full-Time Minimum Experience :
2 Years Work Location :
Fusionopolis
#J-18808-Ljbffr
