Our Newport based client is currently searching for a
Senior Packaging Process Engineer
to work within a challenging R&D environment to explore and develop disruptive semiconductor packaging and integration technologies. The role will involve leading a team of engineers to develop new microelectronic devices with novel new packaging concepts including assembly, wire-bonding and die bonding. Prototype development will be an important part of the role. Required Skills:
Strong semiconductor packaging and assembly experience Semiconductor device knowledge Strong communication and leadership skills Degree qualified in Physics, Electronics, Engineering or equivalent Please contact
Rachel Anderson
for further details.
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