Package Competence Engineer

Nexperia Manchester, England May 17, 2026

Type Contract
Pay Not listed
Work Onsite

Package Competence Engineer focuses on design of our power mosfet packaging, it is our aim to develop you into a subject matter expert.

What the role involves

  • Design of our Power MOSFET packaging, it is our aim to develop you into a subject matter expert.
  • We offer you huge scope to develop and make a real impact on a global semiconductor manufacturer producing over 100 billion devices every year.
  • Leading cross-functional teams in package related projects.
  • Developing extensive links with assembly site engineers and managers to support development and business objectives.
  • Supporting Product Lines and other groups on package related concerns.
  • Generating design rules, new design concepts and patent ideas.

Skills and requirements

  • A degree in Engineering, Physics or a relevant discipline.
  • Extensive knowledge of power semiconductor device packages, materials, equipment and assembly processes from Front end to Back end.
  • An expert grasp of physical properties, chemical properties and the behaviour of materials used in semiconductor packaging.
  • Design of Experiments, AutoCAD, simulation tools, data analysis and technical report writing.

Confirmed role details

  • Possibility for funded academic support up to PhD level, employee goal setting and development plans, huge growth potential both internally and globally within the business, via bo.
  • We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Pa.
  • Nexperia is committed to increasing women in management positions to 30% by 2030.

Candidate fit

  • technical judgement, safe working habits, careful diagnostics, and practical problem-solving
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