Senior Packaging Engineer

Senior Packaging Engineer focuses on the senior packaging process engineer will work on advanced ai infrastructure, co-packaged rf architectures, and photonic systems.

What the role involves

• The Senior Packaging Process Engineer will work on advanced AI infrastructure, co-packaged RF architectures, and photonic systems.
• Develop advanced packaging assembly processes including 2.5D and 3D integration.
• Design and validate high-speed interconnect solutions for system-in-package platforms.
• Define interconnect schemes including flip chip, wafer-level packaging and hybrid bonding.
• Develop process flows covering die attach, underfill, bonding and encapsulation.
• Leading design-for-manufacturing activities with internal and external teams.

Skills and requirements

• Strong experience in semiconductor packaging and microelectronics assembly.
• Hands-on experience with 2.5D/3D integration, hybrid bonding and SiP.
• Experience leading R&D or packaging development projects.
• Understanding of electrical, thermal and system-level integration challenges.

Confirmed role details

• Life Assurance - 4 times annual salary.
• 28 days annual leave in addition to bank holidays.
• Visa Sponsorship and financial relocation assistance.

Candidate fit

• technical judgement, safe working habits, careful diagnostics, and practical problem-solving